Microvia Superfilling Process Control

Microvia Fill Process Boundary Control

This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying...

Computational Models for Microvia Fill Process Control

OF DOCTORAL DISSERTATION AALTO UNIVERSITY SCHOOL OF SCIENCE AND TECHNOLOGY P. O. BOX 11000, FI-00076 AALTO http://www.aalto.fi Author Antti Pohjoranta Name of the dissertation Manuscript submitted October 26, 2009 Manuscript revised February 3, 2010 Date of the defence March 19, 2010 Article dissertation (summary + original articles) Monograph Faculty Department Field of research Opponent(s) Su...

An ALE Model for Prediction and Control of the Microvia Fill Process with Two Additives

Publication P1 A. Pohjoranta and R. Tenno. 2007. A method for microvia-fill process modeling

Advanced Multilayer Polyimide Substrate Utilizing UV Laser Microvia Technology

This paper presents ongoing work on an advanced flexible circuit interconnect substrate featuring a 24 x 24 (576 element) pad grid array pattern at 300 micron pitch. This eight metal layer circuit is being developed as a highdensity, pixel-level interconnection substrate for a two-dimensional (2D) ultrasound imaging transducer MEMS device. The flexible circuit substrate is constructed using lam...